Difference between revisions of "Nook"
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Pokey9000 found a kernel patch for an OMAP3630 Zoom3 devkit, which has a 512MB MCM DDR SDRAM, referencing a part number Hynix H8MBX00U0MER-0EM, giving timings and register values for this part. Looking at the Zoom3 512MB variant memory init code in x-loader shows that there are 2 chip selects of 256MB each. So this is an MCM (stacked chips), 2x256MB each die mDDR. | Pokey9000 found a kernel patch for an OMAP3630 Zoom3 devkit, which has a 512MB MCM DDR SDRAM, referencing a part number Hynix H8MBX00U0MER-0EM, giving timings and register values for this part. Looking at the Zoom3 512MB variant memory init code in x-loader shows that there are 2 chip selects of 256MB each. So this is an MCM (stacked chips), 2x256MB each die mDDR. | ||
<math>Insert formula here</math> | <math>Insert formula here</math> | ||
| + | |||
| + | [http://www.gadgetsdna.com/busybox-installation-steps-on-jailbroken-android-device/683/ Install Busybox on Android] | ||
Latest revision as of 01:14, 4 December 2010
nookie goes here
Cypress TTSP touchscreen and kernel driver and yet another reference
info on meego kernel that might be helpful:
accelerometer application notes and related system programming guide (
MAX8903 based LiOn charger description and datasheet
WiFi/Bluetooth/FM - TI WiLink 6.0 WL1273 datasheet
pokey9000 kernel is 2.6.32-omap1 ( git archive --format=tar --prefix=linux-2.6.32-omap1/ v2.6.32-omap1 | gzip > ../linux-2.6.32-omap1.tar.gz ) stock kernel is v2.6.29-omap1
The audio CODEC is a TI TLV320DAC3100 which has a built in PWM headphone amp, headphone detection, and a mic amp and ADC for a microphone. Unfortunately the headphone jack appears to be a 3-pole TRS style, so there's no mic or control input.
Pokey9000 found a kernel patch for an OMAP3630 Zoom3 devkit, which has a 512MB MCM DDR SDRAM, referencing a part number Hynix H8MBX00U0MER-0EM, giving timings and register values for this part. Looking at the Zoom3 512MB variant memory init code in x-loader shows that there are 2 chip selects of 256MB each. So this is an MCM (stacked chips), 2x256MB each die mDDR. <math>Insert formula here</math>